Eight-layer bluetooth impedance surrounding half-hole plate
Material: FR4 raw overflow TG170
Number of layers: eight-layer impedance circuit board
Minimum line width/line distance: 0.075mm/0.1mm
Minimum aperture: 0.15mmPTH
Minimum hole copper thickness: 20um
Finished copper thickness: 1oz
Surface treatment method: Immersion Gold 4U"
Impedance requirements: single-ended 100 ohms/50 ohms, differential 100/50 ohms.
Outstanding features: This board is a 0.15 mechanical through-hole board, light green ink, FR-4/1.6mm, a...